Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2011 :[The Symposium on Design, Test Integration and Packaging of MEMS/MOEMS (DTIP) was Held in Aix-en-Provence, France 11-13 May 2011 ... 22 Papers]
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2012 |
| ISBN-10 | : OCLC:930893813 |
| ISBN-13 | : |
| Rating | : 4/5 (13 Downloads) |
Book Synopsis Special Issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2011 :[The Symposium on Design, Test Integration and Packaging of MEMS/MOEMS (DTIP) was Held in Aix-en-Provence, France 11-13 May 2011 ... 22 Papers] by :
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