Download or read book Modeling, Design, and Characterization of Through Vias in Silicon and Glass Interposers written by Tapobrata Bandyopadhyay and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advancements in very large scale integration (VLSI) technology have led to unprecedented transistor and interconnect scaling. Further miniaturization by traditional IC scaling in future planar CMOS technology faces significant challenges. Stacking of ICs (3D IC) using three dimensional (3D) integration technology helps in significantly reducing wiring lengths, interconnect latency and power dissipation while reducing the size of the chip and enhancing performance. Interposer technology with ultra-fine pitch interconnections needs to be developed to support the huge I/O connection requirement for packaging 3D ICs. Through vias in stacked silicon ICs and interposers are the key components of a 3D system.