Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects
Author :
Publisher : Springer Science & Business Media
Total Pages : 434
Release :
ISBN-10 : 0442015054
ISBN-13 : 9780442015053
Rating : 4/5 (54 Downloads)

Book Synopsis Mechanics of Solder Alloy Interconnects by : Darrel R. Frear

Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.


Mechanics of Solder Alloy Interconnects Related Books

Mechanics of Solder Alloy Interconnects
Language: en
Pages: 434
Authors: Darrel R. Frear
Categories: Computers
Type: BOOK - Published: 1994-01-31 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as
The Mechanics of Solder Alloy Interconnects
Language: en
Pages: 0
Authors:
Categories: Solder and soldering
Type: BOOK - Published: 1994 - Publisher:

DOWNLOAD EBOOK

Lead-Free Solder Interconnect Reliability
Language: en
Pages: 292
Authors: Dongkai Shangguan
Categories: Technology & Engineering
Type: BOOK - Published: 2005 - Publisher: ASM International

DOWNLOAD EBOOK

Area Array Interconnection Handbook
Language: en
Pages: 1250
Authors: Karl J. Puttlitz
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Language: en
Pages: 153
Authors: Qingke Zhang
Categories: Science
Type: BOOK - Published: 2015-10-31 - Publisher: Springer

DOWNLOAD EBOOK

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under