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Language: en
Pages: 254
Pages: 254
Type: BOOK - Published: 2013-09-20 - Publisher: Springer Science & Business Media
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.
Language: en
Pages: 290
Pages: 290
Type: BOOK - Published: 1997 - Publisher: McGraw Hill Professional
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information coveri
Language: en
Pages: 448
Pages: 448
Type: BOOK - Published: 2009-06-05 - Publisher: McGraw Hill Professional
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wir
Language: en
Pages: 694
Pages: 694
Type: BOOK - Published: 2006-05-10 - Publisher: Springer Science & Business Media
From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond p
Language: en
Pages: 974
Pages: 974
Type: BOOK - Published: 2016-11-18 - Publisher: Springer
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
