Download or read book 2018 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP) written by IEEE Staff and published by . This book was released on 2018-05-22 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: DTIP 2018 will be the 20th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS This unique single meeting event brings together participants interested in MEMS MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS MOEMS All aspects including design, modeling, testing, micro machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks