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Language: en
Pages: 93
Pages: 93
Type: BOOK - Published: 2011-06-20 - Publisher: Now Publishers Inc
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the s
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Pages: 807
Pages: 807
Type: BOOK - Published: 2007-07-22 - Publisher: McGraw Hill Professional
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bul
Language: en
Pages: 508
Pages: 508
Type: BOOK - Published: 2017-07-24 - Publisher: John Wiley & Sons
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
Language: en
Pages: 254
Pages: 254
Type: BOOK - Published: 2019-10-17 - Publisher: KIT Scientific Publishing
Language: en
Pages: 324
Pages: 324
Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi