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Reduced Thermal Processing for ULSI
Language: en
Pages: 444
Authors: R.A. Levy
Categories: Science
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget f
Proceedings of the Symposium on Reduced Temperature Processing for VLSI
Language: en
Pages: 634
Authors: Rafael Reif
Categories: Integrated circuits
Type: BOOK - Published: 1986 - Publisher:

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ULSI Science and Technology, 1989
Language: en
Pages: 804
Authors: C. M. Osburn
Categories: Integrated circuits
Type: BOOK - Published: 1989 - Publisher:

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ULSI Science and Technology/1987
Language: en
Pages: 874
Authors: S. Broydo
Categories: Integrated circuits
Type: BOOK - Published: 1987 - Publisher:

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Advances in Rapid Thermal and Integrated Processing
Language: en
Pages: 568
Authors: F. Roozeboom
Categories: Science
Type: BOOK - Published: 2013-03-09 - Publisher: Springer Science & Business Media

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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and