Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics

Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics
Author :
Publisher :
Total Pages : 344
Release :
ISBN-10 : 0780398068
ISBN-13 : 9780780398061
Rating : 4/5 (68 Downloads)

Book Synopsis Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics by : Leo J. Ernst

Download or read book Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics written by Leo J. Ernst and published by . This book was released on 2001 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics Related Books

Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics
Language: en
Pages: 344
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Language: en
Pages: 195
Authors: G.Q. Zhang
Categories: Technology & Engineering
Type: BOOK - Published: 2013-06-29 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For
Proceedings of the 2nd International Conference on Innovation and Technology in Sports, ICITS 2023, 27–28 November, Malaysia
Language: en
Pages: 606