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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
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In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
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Advanced Thermal Design of Electronic Equipment
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With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits o