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Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and
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Deep Sub-Micron (DSM) processes present many changes to Very Large Scale Integration (VLSI) circuit designers. One of the greatest challenges is crosstalk, whic
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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV).
