Materials for Advanced Packaging

Materials for Advanced Packaging
Author :
Publisher : Springer
Total Pages : 974
Release :
ISBN-10 : 9783319450988
ISBN-13 : 3319450980
Rating : 4/5 (88 Downloads)

Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.


Materials for Advanced Packaging Related Books

Materials for Advanced Packaging
Language: en
Pages: 974
Authors: Daniel Lu
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

DOWNLOAD EBOOK

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Semiconductor Advanced Packaging
Language: en
Pages: 513
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature

DOWNLOAD EBOOK

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Advanced Packaging
Language: en
Pages: 28
Authors:
Categories:
Type: BOOK - Published: 2009-01 - Publisher:

DOWNLOAD EBOOK

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing
Advanced Flip Chip Packaging
Language: en
Pages: 562
Authors: Ho-Ming Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2013-03-20 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly pro
Advanced Materials for Thermal Management of Electronic Packaging
Language: en
Pages: 633
Authors: Xingcun Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in