Download or read book 2020 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP) written by IEEE Staff and published by . This book was released on 2020-06-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: DTIP 2020 will be the 21th anniversary edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS This unique single meeting event brings together participants interested in MEMS MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS MOEMS All aspects including design, modeling, testing, micro machining, integration and packaging of structures, devices and systems are addressed in two main Conferences Due to the sanitary crisis, DTIP2020 is moving online